- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 29/32 - Semiconductor bodies having polished or roughened surface the imperfections being within the semiconductor body
Patent holdings for IPC class H01L 29/32
Total number of patents in this class: 556
10-year publication summary
|
52
|
88
|
76
|
75
|
67
|
45
|
36
|
36
|
32
|
9
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Fuji Electric Co., Ltd. | 4750 |
131 |
| Infineon Technologies AG | 8189 |
43 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
43 |
| Denso Corporation | 23338 |
24 |
| Mitsubishi Electric Corporation | 43934 |
19 |
| Rohm Co., Ltd. | 5843 |
17 |
| Toshiba Corporation | 12017 |
15 |
| Infineon Technologies Austria AG | 1954 |
13 |
| GLOBALFOUNDRIES U.S. Inc. | 6459 |
11 |
| International Business Machines Corporation | 60644 |
10 |
| Semiconductor Components Industries, L.L.C. | 5345 |
9 |
| Sumitomo Electric Industries, Ltd. | 14131 |
7 |
| Seoul Semiconductor Co., Ltd. | 1073 |
7 |
| Sumco Corporation | 1116 |
7 |
| Globalwafers Co., Ltd. | 561 |
6 |
| Shin-Etsu Handotai Co., Ltd. | 1277 |
6 |
| Daedalus Prime LLC | 110 |
6 |
| Intel Corporation | 45621 |
5 |
| 3-5 Power Electronics GmbH | 19 |
5 |
| Resonac Corporation | 2233 |
5 |
| Other owners | 167 |